This module develops the knowledge, understanding and skills required for the design, manufacture and testing of electronic circuits.
It also introduces the simulation of telecommunication systems.
A mixture of lectures and practical sessions will be delivered.

Topics covered will include:

PCB Design considerations for THT and SM devices
Design for EMC
Thermal and Mechanical Considerations
Assembly and manufacturing techniques
Testing of completed products
Telecommunication simulation using MATLAB

The learning strategy of this module requires 36 hours of class supported learning.

As guidance, students may typically be expected to allocate the hours indicated below to the following activities during independent and self-directed study time, reading and preparation for lectures (32), work based learning (20), additional research and reading (12), preparation of coursework assignments (50).

During this module students will take part in:-
Formal lectures
Discussions
Practicals

PCB Design Software
PCB manufacturing facility
MATLAB

Williams, T. (2016) EMC For Product Designers 5th Edition, Newnes

Zungeru, A.M. et al. (2017) Handbook of Laboratory Experiments in Electronics and Communication Engineering: Vol. 2, Chennai: Notion Press.

Xue, D. & Chen, Y. (2014) System Simulation Techniques with MATLAB and Simulink, Chichester: John Wiley and Sons, Ltd.

Attaway, S. (2018) MATLAB: A Practical Introduction to Programming and Problem Solving, 5th Edn., Oxford: Butterworth-Heinemann

Hahn, B. & Valetine, D.T. (2016) Essential MATLAB for Engineers and Scientists, 6th Edn., Oxford: Academic Press

Proakis, John G (2013) Contemporary communication systems using MATLAB, 3rd ed., Cengage Learning Australia

1. Critically evaluate the requirements for design, manufacture and testing of electronic products. (AHEP 3: D1, D2, D4, P1, P4)

2. Produce and test practical examples of product designs. (AHEP 3: D3b, D4, D5, P1, P2, P3, P8)

3. Formulate, design and conduct simulations of telecommunication systems using a computer-based simulation package. (AHEP 3: SM1b, EA1b, EA2, P3, G1)

1. Written report describing the design, manufacture and testing of a printed circuit board - assessing learning outcomes 1 and 2. Meeting AHEP 3 Outcomes D1, D2, D3b, D4, D5, P1, P2, P3, P4, P8.

2. Written report describing the modelling and simulation of a telecommunication system - assessing learning outcome 3. Meeting AHEP 3 Outcomes SM1b, EA1b, EA2, P3, G1.