1) Transistor-level subsystems, physical layout and fabrication.
2) Custom and semi-custom IC design and architecture.
3) Ultra-fast VLSI Technology.
4) Packaging, testing and thermal considerations.
5) Modelling and simulation techniques using state-of-the-art computer aided design tools.

- Class attendance (3 hours per week)
- Directed reading and learning
- Use of software packages
- Lecture/laboratory/tutorial 36 hours
- Student centred learning 114 hours

Electronic Devices and Material laboratory
Software packages (e.g. ISE T-CAD OrCAD, etc)
IC fabrication video material
Lectures, library, computing facilities, Internet

Microelectronics Level 3 or equivalent.

1) Two comprehensive formal reports detailing two pieces of in-course work (40%), learning outcomes 3, 4, 5 and 6.
2) Two hour written examination (60%), learning outcomes 1, 2, 3 and 7.

The two formal reports detail two different pieces of coursework. They will present work carried out during the course and will use a range of diverse tools. The total mark allocated for these two pieces of coursework is 40%.

Students will also attend a 2 hour, written examination (60%) at the end of the module.

Silicon VLSI Technology, J. D. Plummer, Second Edition, Prentice Hall, 2003, ISBN: 0130850373
Digital Integrated Circuits, J. M. Rabaey, Second Edition, Prentice Hall, 2003, ISBN: 0131786091
ULSI Technology, Chang and Sze, McGraw-Hill, 1996, ISBN: 0071141057